Our hinge torsion spring is a precision-engineered solution tailored for foldable smartphone hinge mechanisms. It delivers stable and consistent torque to ensure smooth opening and closing, reducing stress on the hinge and extending device lifespan. Manufactured from high-grade stainless steel or alloy materials, the spring offers superior fatigue resistance, corrosion protection, and mechanical stability under high cycle counts. Ideal for compact and high-precision assemblies, it supports tight tolerance requirements and custom specifications. Perfect for OEMs and device manufacturers looking to enhance hinge durability, alignment accuracy, and tactile performance in next-generation foldable electronics.
Features
Stable Torque Output: Provides consistent and reliable torsional force for smooth folding/unfolding action.
High Fatigue Resistance: Designed to withstand millions of folding cycles without performance degradation.
Compact & Precise Design: Supports miniaturized hinge systems with tight tolerance requirements.
Premium Materials: Made from stainless steel or high-strength alloys for excellent corrosion and wear resistance.
Customizable Specifications: Torque range, wire diameter, leg geometry, and surface treatments can be tailored to meet specific OEM needs.
Enhanced Device Longevity: Reduces mechanical stress and misalignment, improving overall hinge durability and smartphone life cycle.
Low Noise Operation: Engineered to minimize operational noise during motion, enhancing user experience.
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We will help you to find the best solution.